Product introduction: KEDLED copper wire ceramic nozzle is developed from ruby material, also commonly known as palladium plated copper wire ceramic nozzle. The ceramic body itself is red all over, so it is also called pink ceramic nozzle.

Copper coin porcelain mouth is different from conventional gold wire porcelain mouth. Due to the higher hardness of copper wire compared to gold wire, the probability of wire breakage and non bonding during the pressure welding process is relatively increased. Therefore, KEDLED copper wire ceramic nozzle is produced and processed using impact resistant, high wear-resistant, and high hardness ruby nano ceramic raw materials. At the same time, the surface of the ceramic nozzle is roughened, which overcomes the problem of non stick sliding balls during the pressure welding process and greatly improves the lifespan of the ceramic nozzle itself.

The selection of copper wire ceramic nozzle: The cutting knife used for copper wire and the welding force on the surface. At the same time, attention should be paid to the following differences in the shape and size of the cleaver:

(1) The T-side of the copper wire chopper should be slightly larger. If it is too small, the second pressure point (2nd) is prone to cutting, causing insufficient or uneven tension;

⑵ The copper wire cleaver CD can remain basically unchanged, and it is prone to non stick phenomena if it is too large or too small;

The copper wire chopper H (aperture) should be 8 μ m larger than the diameter of the copper wire, as being too small can easily cause it to break at the neck;

The angle value of the copper wire cleaver CA can be appropriately reduced. If it is too large, it may cause uneven wire arc, but if it is too small, the neck of the wire arc is prone to breakage;

⑸ The selection of copper wire cleaver FA generally requires a temperature below 8 degrees (4-8 degrees);

The selection of copper wire cleaver OR is similar to that of gold wire.

KEDLED copper wire ceramic nozzle is used for various commonly used and special specifications of copper wire, such as 0.6mil, 0.8mil, 0.9mil, 1.0mil, 1.15mil, 1.25mil, 1.3mil, 1.5mil and other specifications.

The difference in process parameters between copper wire and gold wire: The basic parameters that need to be considered in copper wire bonding include bonding and contact power/force/time. Compared to gold wire:

a. The EFO process requires a larger electronic ignition current and a relatively shorter ignition time;

b、 Bonding usually requires greater welding force and power, as well as longer welding time. Therefore, in addition to increasing these parameters at both the first ball key and the second wedge line welding point, it is also necessary to determine (through process testing) the standby power and welding pressure for the first bonding step to improve the bonding quality of the ball key, while avoiding the possibility of bonding craters (Craters); Furthermore, it is necessary to consider longer bonding times to improve lead stability during the second bonding period; The optimal standby power in the direction of the welding line and friction in the vertical direction will also help to achieve excellent, firm welding shape and good tensile strength.

Compared to gold wire, copper wire bonding should also pay attention to the following points in equipment parameter settings (determined by process test data):

In the EFO process, the setting of electronic ignition device parameters, especially the setting of electronic ignition current, has an impact on the hardness of the brazed ball. Relatively reducing (or increasing) the firing current and appropriately increasing (or reducing) the firing time require repeated experiments to control the melting temperature and spherical shape of the ball, in order to alleviate the effect of sudden heating and cooling on the hardening of the ball. Experiments have shown that increasing the ignition current (too much) can lead to an increase in the hardness of the solder ball;

Under normal circumstances, the ignition of copper wire into balls is carried out above the first welding point position, rather than at the position after the second welding point, in order to shorten the time from ball formation to welding as much as possible and prevent the surface of the ball from cooling and hardening. Appropriately reduce the ultrasonic energy during ball welding contact, while relatively increasing the thermal welding pressure, so that the welding meets the requirements of copper wire ball welding process at low ultrasonic energy, in order to avoid the risk of aluminum layer craters in the bonding area;

The second bonding point (wedge welding) is a challenge to the quality of copper wire bonding, and its welding quality and shape directly affect the quality of ball formation and ball welding at the first welding point. Due to the higher hardness of copper wire compared to gold, greater ultrasonic energy, welding pressure, and longer welding time are required during the second bonding period. To improve the stability and reliability of lead welding on the framework and ensure the consistency of the first solder joint ball formation;

⑷ There may also be some issues when the second solder joint of the frame produces wire tails. For larger wire diameters (>30um), it may be more stable, but for smaller wire diameters (≤ 25um), there may be some inconsistent wire tails. These phenomena may be related to the large crystalline particles of copper wire, where gold wire has smaller micrometer sized extension particles and copper wire is only a few micrometers larger. Thin wire diameter copper wire has fewer particles, and its tensile strength depends more on the grain arrangement and direction, which is different from large wire diameter copper wire. This leads to deformation, strength, and instability of the wire tail, and also affects the size of the second solder joint; Because the formation of the second solder joint of the framework will depend on many large particles with different orientations, which affects the tensile strength and sometimes leads to inconsistency of the second solder joint. Different lengths of wire tails may result from the pulling of copper wires with different behaviors, leading to the formation of small balls in the next balloon.

The biggest change in copper wire pressure welding process parameters compared to gold wire is the increase in welding pressure (contact force) to enhance its weldability. At the same time, in order to reduce the risk of bullet holes, the depth of the copper ball should generally not exceed half of the thickness of the aluminum layer. Suggestion: Usually, copper wires below 1mil should use low-power mode, while copper wires above 1.2mil should use high-power mode.